Check for vias inside pads - #180
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| test("reports a via whose center is inside an SMD pad", async () => { | ||
| const circuitJson: AnyCircuitElement[] = [makeBoard(), rectPad, viaInRectPad] | ||
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| const errors = checkViasInPads(circuitJson) | ||
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| expect(errors).toHaveLength(1) | ||
| expect(errors[0]).toMatchObject({ | ||
| type: "pcb_placement_error", | ||
| pcb_placement_error_id: "via_in_pad_pcb_via_1_pcb_smtpad_1", | ||
| error_type: "pcb_placement_error", | ||
| }) | ||
| expect(errors[0].message).toContain("is inside SMD pad") | ||
| expect(containsCircuitJsonId(errors[0].message)).toBe(false) | ||
| expect(await runAllPlacementChecks(circuitJson)).toContainEqual(errors[0]) | ||
| }) | ||
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| test("uses true pad geometry for circular, polygon, and plated-hole pads", () => { | ||
| const circuitJson: AnyCircuitElement[] = [ | ||
| makeBoard(), | ||
| { | ||
| type: "pcb_smtpad", | ||
| pcb_smtpad_id: "pcb_smtpad_circle", | ||
| shape: "circle", | ||
| x: -4, | ||
| y: 0, | ||
| radius: 0.5, | ||
| layer: "top", | ||
| }, | ||
| { | ||
| type: "pcb_smtpad", | ||
| pcb_smtpad_id: "pcb_smtpad_polygon", | ||
| shape: "polygon", | ||
| points: [ | ||
| { x: -0.5, y: -0.5 }, | ||
| { x: 0.5, y: -0.5 }, | ||
| { x: 0, y: 0.5 }, | ||
| ], | ||
| layer: "top", | ||
| }, | ||
| { | ||
| type: "pcb_plated_hole", | ||
| pcb_plated_hole_id: "pcb_plated_hole_1", | ||
| shape: "circle", | ||
| x: 4, | ||
| y: 0, | ||
| outer_diameter: 1, | ||
| hole_diameter: 0.5, | ||
| layers: ["top", "bottom"], | ||
| }, | ||
| { | ||
| ...viaInRectPad, | ||
| pcb_via_id: "pcb_via_circle", | ||
| x: -4.2, | ||
| y: 0, | ||
| }, | ||
| { | ||
| ...viaInRectPad, | ||
| pcb_via_id: "pcb_via_polygon", | ||
| x: 0, | ||
| y: 0, | ||
| }, | ||
| { | ||
| ...viaInRectPad, | ||
| pcb_via_id: "pcb_via_plated_hole", | ||
| x: 4, | ||
| y: 0, | ||
| }, | ||
| ] | ||
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| expect(checkViasInPads(circuitJson)).toHaveLength(3) | ||
| }) | ||
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| test("ignores vias outside pads and vias on non-overlapping layers", () => { | ||
| const circuitJson: AnyCircuitElement[] = [ | ||
| makeBoard(), | ||
| rectPad, | ||
| { | ||
| ...viaInRectPad, | ||
| pcb_via_id: "pcb_via_outside", | ||
| x: 2, | ||
| y: 2, | ||
| }, | ||
| { | ||
| ...viaInRectPad, | ||
| pcb_via_id: "pcb_via_inner_layers", | ||
| x: 0, | ||
| y: 0, | ||
| layers: ["inner1", "inner2"], | ||
| }, | ||
| ] | ||
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| expect(checkViasInPads(circuitJson)).toEqual([]) | ||
| }) | ||
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| test("respects the board via-in-pad allowance", () => { | ||
| const allowedCircuit: AnyCircuitElement[] = [ | ||
| makeBoard(true), | ||
| rectPad, | ||
| viaInRectPad, | ||
| ] | ||
| const disallowedCircuit: AnyCircuitElement[] = [ | ||
| makeBoard(false), | ||
| rectPad, | ||
| viaInRectPad, | ||
| ] | ||
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| expect(checkViasInPads(allowedCircuit)).toEqual([]) | ||
| expect(checkViasInPads(disallowedCircuit)).toHaveLength(1) | ||
| }) |
Contributor
There was a problem hiding this comment.
This file contains 4 test(...) calls (at lines 49, 65, 121, and 143), but the style guide requires that a *.test.ts file may have AT MOST one test(...). After the first test, the remaining tests should be split into separate, numbered files. For example: check-vias-in-pads1.test.ts, check-vias-in-pads2.test.ts, check-vias-in-pads3.test.ts, and check-vias-in-pads4.test.ts.
Suggested change
| test("reports a via whose center is inside an SMD pad", async () => { | |
| const circuitJson: AnyCircuitElement[] = [makeBoard(), rectPad, viaInRectPad] | |
| const errors = checkViasInPads(circuitJson) | |
| expect(errors).toHaveLength(1) | |
| expect(errors[0]).toMatchObject({ | |
| type: "pcb_placement_error", | |
| pcb_placement_error_id: "via_in_pad_pcb_via_1_pcb_smtpad_1", | |
| error_type: "pcb_placement_error", | |
| }) | |
| expect(errors[0].message).toContain("is inside SMD pad") | |
| expect(containsCircuitJsonId(errors[0].message)).toBe(false) | |
| expect(await runAllPlacementChecks(circuitJson)).toContainEqual(errors[0]) | |
| }) | |
| test("uses true pad geometry for circular, polygon, and plated-hole pads", () => { | |
| const circuitJson: AnyCircuitElement[] = [ | |
| makeBoard(), | |
| { | |
| type: "pcb_smtpad", | |
| pcb_smtpad_id: "pcb_smtpad_circle", | |
| shape: "circle", | |
| x: -4, | |
| y: 0, | |
| radius: 0.5, | |
| layer: "top", | |
| }, | |
| { | |
| type: "pcb_smtpad", | |
| pcb_smtpad_id: "pcb_smtpad_polygon", | |
| shape: "polygon", | |
| points: [ | |
| { x: -0.5, y: -0.5 }, | |
| { x: 0.5, y: -0.5 }, | |
| { x: 0, y: 0.5 }, | |
| ], | |
| layer: "top", | |
| }, | |
| { | |
| type: "pcb_plated_hole", | |
| pcb_plated_hole_id: "pcb_plated_hole_1", | |
| shape: "circle", | |
| x: 4, | |
| y: 0, | |
| outer_diameter: 1, | |
| hole_diameter: 0.5, | |
| layers: ["top", "bottom"], | |
| }, | |
| { | |
| ...viaInRectPad, | |
| pcb_via_id: "pcb_via_circle", | |
| x: -4.2, | |
| y: 0, | |
| }, | |
| { | |
| ...viaInRectPad, | |
| pcb_via_id: "pcb_via_polygon", | |
| x: 0, | |
| y: 0, | |
| }, | |
| { | |
| ...viaInRectPad, | |
| pcb_via_id: "pcb_via_plated_hole", | |
| x: 4, | |
| y: 0, | |
| }, | |
| ] | |
| expect(checkViasInPads(circuitJson)).toHaveLength(3) | |
| }) | |
| test("ignores vias outside pads and vias on non-overlapping layers", () => { | |
| const circuitJson: AnyCircuitElement[] = [ | |
| makeBoard(), | |
| rectPad, | |
| { | |
| ...viaInRectPad, | |
| pcb_via_id: "pcb_via_outside", | |
| x: 2, | |
| y: 2, | |
| }, | |
| { | |
| ...viaInRectPad, | |
| pcb_via_id: "pcb_via_inner_layers", | |
| x: 0, | |
| y: 0, | |
| layers: ["inner1", "inner2"], | |
| }, | |
| ] | |
| expect(checkViasInPads(circuitJson)).toEqual([]) | |
| }) | |
| test("respects the board via-in-pad allowance", () => { | |
| const allowedCircuit: AnyCircuitElement[] = [ | |
| makeBoard(true), | |
| rectPad, | |
| viaInRectPad, | |
| ] | |
| const disallowedCircuit: AnyCircuitElement[] = [ | |
| makeBoard(false), | |
| rectPad, | |
| viaInRectPad, | |
| ] | |
| expect(checkViasInPads(allowedCircuit)).toEqual([]) | |
| expect(checkViasInPads(disallowedCircuit)).toHaveLength(1) | |
| }) | |
| test("reports a via whose center is inside an SMD pad", async () => { | |
| const circuitJson: AnyCircuitElement[] = [makeBoard(), rectPad, viaInRectPad] | |
| const errors = checkViasInPads(circuitJson) | |
| expect(errors).toHaveLength(1) | |
| expect(errors[0]).toMatchObject({ | |
| type: "pcb_placement_error", | |
| pcb_placement_error_id: "via_in_pad_pcb_via_1_pcb_smtpad_1", | |
| error_type: "pcb_placement_error", | |
| }) | |
| expect(errors[0].message).toContain("is inside SMD pad") | |
| expect(containsCircuitJsonId(errors[0].message)).toBe(false) | |
| expect(await runAllPlacementChecks(circuitJson)).toContainEqual(errors[0]) | |
| }) | |
Spotted by Graphite (based on custom rule: Custom rule)
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Contributor
|
Thank you for your contribution! 🎉 PR Rating: ⭐⭐ Track your contributions and see the leaderboard at: tscircuit Contribution Tracker |
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Summary
checkViasInPadsrunAllPlacementChecks/runAllCheckspcb_board.is_via_in_pad_allowedis explicitlytrueWhy
Via-in-pad usually requires an intentional manufacturing process. With the new circuit-json board flag, checks can reject accidental vias in pads while allowing designs that explicitly opt in.
The rule uses backward-compatible feature detection for the board flag so this focused PR does not need to pull in unrelated schema migrations through the repository's pinned development dependency.
Validation
bun test tests/lib/check-vias-in-pads.test.ts(4 passing)bun test(141 passing)bunx tsc --noEmitbun run buildbunx @tscircuit/dependency-checkgit diff --check